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Layout for 9 Pin BGA

PostPosted: Mon Mar 17, 2014 12:58 pm
by bdrballard
I am trying to use PCB123 to layout for a 9 pin BGA package (a TI DRV2605). The package is arranged as a 3 x 3 array. TI's layout recommendations recommend a 275 micrometer pad size with a maximum trace size of 75 to 100 micrometers. It appears that a .005 inch trace is the minimum I can do. The required trace size is between .0029 and .0039 inches to the array pads. It seems to be impossible to get connectivity to the middle pin in the array.

The array has .5mm spacing on the balls.

Any suggestions on how to solve this problem. Is this impossible with PCB123?

Thanks for your help.

Dan

Re: Layout for 9 Pin BGA

PostPosted: Tue Mar 18, 2014 6:04 am
by Sal Hernandez
The smallest trace you can create in PCB123 is 5 mils. What another customer has done is designed the part with 5 mil traces then included notes for our Custom Quote team to reduce the trace size in the specific area. This will work, but will leave you with errors within PCB123.