I am trying to use PCB123 to layout for a 9 pin BGA package (a TI DRV2605). The package is arranged as a 3 x 3 array. TI's layout recommendations recommend a 275 micrometer pad size with a maximum trace size of 75 to 100 micrometers. It appears that a .005 inch trace is the minimum I can do. The required trace size is between .0029 and .0039 inches to the array pads. It seems to be impossible to get connectivity to the middle pin in the array.
The array has .5mm spacing on the balls.
Any suggestions on how to solve this problem. Is this impossible with PCB123?
Thanks for your help.