Sunstone Printed Circuit Board Forum

I would like to edit the solder paste layer for my D2PAK footprint so I get a segmented paste pattern on the large (drain) pad. The paste mask opening that gets automatically generated has an opening the same size as the pad, but my PCB gurus tell me this will result in too much paste being screened onto the pad, which will cause the part to float during reflow. Is there a way I can change the paste mask opening for this footprint to have, say, four smaller openings covering a total of about 50% of the pad instead of one large opening?

Bill,

PCB123 does not have a paste layer that you can edit. The paste file is generated from the surface mount pads on the top and bottom copper layers. You will need to modify the gerber paste file to get what you need.

Hi Sal,

In V5.2 are we able to modify the solder paste layer ?

If not, is this something that Screaming Ckts can take care of if requested ?

Thanks,
bob

Bob,

V5.2 still cannot edit the solder paste layer. You will still need to get the gerber file to edit it from there. Screaming Circuits would not be able to edit the .123 file, but you would have to ask someone on their side if they can edit the gerber file. If you have a file you want us to look at please send it to support@sunstone.com.