by Bill1900 » Tue Feb 04, 2014 2:27 pm
I would like to edit the solder paste layer for my D2PAK footprint so I get a segmented paste pattern on the large (drain) pad. The paste mask opening that gets automatically generated has an opening the same size as the pad, but my PCB gurus tell me this will result in too much paste being screened onto the pad, which will cause the part to float during reflow. Is there a way I can change the paste mask opening for this footprint to have, say, four smaller openings covering a total of about 50% of the pad instead of one large opening?